Wafer Bonding
Model no：32000
Existing and emerging applications like advanced packaging and power devices require permanent wafer bonding. Canon has developed equipment that uses Atomic Diffusion Bonding technology and is able to bond wafers at room temperature without application of high pressure. This not only makes the processing easier and faster but also enables new applications.
Delivery:
Ships
minimum order:
1 ton
Supply Ability:
1ton / Month
Country of Origin:
Europe and America
Stock Time:
30Day
Quantity:
BC7000 Atomic Diffusion Bonding equipment is based on Canon ANELVA's long experience with vacuum and thin film deposition technologies.This equipment offers ultra-high vacuum in-situ processes of wafer transfer, film deposition, bonding and bonded wafer collection with automatic operation.It is capable of handling 4inch and 6inch wafers. Mirror polished wafers of any materials can be permanently bonded at room temperature without application of pressure.
Mass producing
leading-edge microchips
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EXE systems
EXE, or ‘High NA’, systems are the latest generation in EUV lithography. With a numerical aperture (NA) of 0.55, their innovative new optics provide higher contrast and print with a resolution of just 8nm.
The EXE platform will support high-volume chip manufacturing in 2025–2026, enabling geometric chip scaling into the next decade. That will include future advanced nodes, starting at the 2 nm Logic node and followed by Memory nodes at a similar density. By reducing the number of process steps in high-volume manufacturing, chipmakers will benefit from significant reductions in defects, cost and cycle time.
Offers lower cost alternatives to purchasing new equipment. Through these programs, Canon U.S.A. aims to reduce the costs and risks that may occur with third party installation of used Canon photolithography equipment. Canon U.S.A. works together with its global affiliates to deliver outstanding equipment performance, quality and price with the reliability of Canon support and approved dealers.
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